Thermal Gap Pads

Resin Designs Thermal Gap Pads are made of soft silicone and thermal conductors. They are used to help remove heat in computers, tablets, smart phones, displays, and many other electronic applications. The pads can be cut to virtually any size or shape and are easily placed, requiring no additional time to cure. They are just as easily removed for rework.

Thermal Gap Pads are available in thicknesses from 0.25 mm to 5.3 mm (0.01″ – 0.21″). Whether interfacing a small heat sink to a single chip or an entire module to metal plate, our compressible Thermal Gap Pads are the ideal solution.

Pre-cured thermal pads are used in TIM applications with gaps of 0.25 to 5.0 mm between component and heat sink. They are usually supplied in sheet form or in roll form as die-cut pieces and applied either manually or with automation. Fully cured from the factory, thermal pads have less shelf life concerns and devices can be assembled and packaged immediately. Most pre-cured pads are soft and gel-like to minimize compression forces on the electronics and available in a broad range of both thicknesses and thermal conductivity.

Read about our Thermal Gap Pads

PRODUCTS

PRODUCTS THERMAL COND W/MK SHORE OO SUPPORT CARRIER UL 94 THICKNESSES (MM)
TP-1502 (2-SIDES TACKY) 0.9 40 – 70 Fiberglass V0 0.25 – 2.5
TP-1562 (1-SIDE TACKY) 0.8 40 – 70 Fiberglass V0 0.25 – 1.5
TP-2200HP (2-SIDE TACKY) 1.6 70 max Fiberglass V1 0.25 – 1.0
V0 1.5 – 3.0
TP-2260HP (1-SIDE TACKY) 1.6 70 max Fiberglass V0 0.25 – 2.0
TP-2860 (1-SIDE TACKY) 2.5 45 max Fiberglass V1 0.25 – 2.0
TP-3500 (2-SIDE TACKY) 3.3 70 max Fiberglass V0 0.25 – 3.0
TP-3500-SOFT (2-SIDE TACKY) 3.3 45 max Fiberglass V1 0.25 – 1.5
V0 2.0 – 3.0
TP-3560 (1-SIDE TACKY) 3.3 70 max Fiberglass V1 0.25 – 2.0
TP-3560-SOFT (1-SIDE TACKY) 3.3 45 max Fiberglass V1 0.25 – 1.5
V0 2.0
TP-2101 (2-SIDE TACKY) 0.7 70 max Foam V1 1.5 – 4.0
V0 4.6 – 5.3
TP-2160 (1-SIDE TACKY) 0.7 70 max Foam HB 2.2 – 5.0
TP-2300 (2-SIDE TACKY) 1.25 65 max Foam HB 2.2 – 3.8
V0 4.6 – 5.0