B-Staged Epoxy Film

Epoxy film is an all solid material that enables excellent control of the quantity and placement of adhesive. It can be provided in sheet, roll, or custom preform formats. Epoxy film is heat cured, preferably with a modest applied pressure, and delivers robust bonds with a wide variety of materials. It is ideal for bonding large areas or complex shapes of any size.

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PRODUCTS

tools for b-staged epoxy

Product Filler Features
I2701F None TechFilm I2701F is a high performance electrically isolating B-staged film adhesive specially formulated for bonding at lower temperatures. TechFilm I2701F will cure at temperatures above 90°C. It features good chemical, heat, and moisture resistance.
T2222F Alumina TechFilm T2222F is a high performance thermally conductive B-staged film adhesive specially formulated for bonding to gold, nickel, and other hard to bond substrates. T2222F will cure at temperatures above 115°C and features good chemical, heat, and moisture resistance.
T2781F Aluminum TechFilm T2781F is a high performance, high thermally conductive/electrically insulating, B-staged film adhesive. It features a fast cure time, high thermal conductivity, and good adhesion to various substrates. It also features good chemical, heat, and moisture resistance. TechFilm T2781F will cure at temperatures above 100°C.
E2213F Silver TechFilm E2213F is a high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold or gold plated substrates. TechFilm E2213F is especially suited for EMI/RF grounding applications. This product will cure at temperatures above 120°C and features good chemical, heat, and moisture resistance.